Manual Wafer Mounting System Market

Market Overview

The Global Manual Wafer Mounting System Market Size is projected to grow at CAGR of approximately 3.4% during the forecast period.

The semiconductor equipment market, which includes the production and distribution of manual wafer mounting systems, is referred to as the market. During procedures like lithography, etching, and thin film deposition, silicon wafers need to be held and aligned, and for this purpose, manual wafer mounting systems are used.

Market Dynamics

Market Dynamic

Microchips and other electronic components are in high demand due to the proliferation of electronic gadgets like smartphones, tablets, and wearables. In turn, this is fueling interest in the manual wafer mounting techniques necessary to produce these parts.

• Innovations in Semiconductor Technology

New semiconductor technologies and manufacturing techniques are continually being developed. Therefore, there is always a pressing need for cutting-edge developments in manual wafer mounting methods.

Increased demand for electronic components, especially in the form of advanced driver assistance systems (ADAS) and other safety features, is a direct result of the booming car industry. As a result, there has been a rise in the need for manual wafer mounting techniques to produce these parts.

As competition in the semiconductor sector increases, businesses will need to increase their R&D spending to maintain a competitive edge. As a result, there has been a rise in the need for manual wafer mounting solutions to aid in product innovation.

Market Restraints

Manual wafer mounting solutions may be expensive, putting them out of reach of many small and medium-sized businesses. Because of this, it may be difficult for small businesses to invest in the machinery they need to stay competitive.

The semiconductor sector is one that experiences rapid technological change, with new technologies and techniques being produced on a regular basis. Because of this, it may be challenging for factories to stay up with technological advances and make timely investments in necessary equipment.

Market Opportunities

Demand for manual wafer mounting methods is likely to rise as the implementation of 5G technology increases the need for novel semiconductor components.

More and more people want to buy smart home and industrial equipment that is linked to the Internet of Things (IoT). This is anticipated to enhance demand for manual wafer mounting solutions and promote expansion in the semiconductor sector.

Opportunities for makers of manual wafer mounting systems may arise in developing economies, as the rising middle class in places like India and Southeast Asia drives up demand for electronic gadgets and parts.

The fourth industrial revolution, often known as Industry 4.0, is pushing the manufacturing sector toward greater levels of automation and digitization. Because of this, the market for manual wafer mounting systems may see growth as demand for high-tech semiconductor components rises.

The growing use of automation and robots is a new development in the field of manual wafer mounting systems. It's no secret that the semiconductor industry could benefit greatly from process automation. Because of this, automated wafer mounting methods have been created to accommodate a large variety of semiconductor materials and components.

New materials and technologies are being developed for use in the semiconductor sector, which is another trend. For instance, fan-out wafer level packaging (FOWLP) is a relatively new material that has enabled the creation of smaller, more energy-efficient electronic devices in response to the rising need for innovative packaging solutions. As a result, advanced manual wafer mounting methods have been developed to accommodate these cutting-edge materials and techniques.

Market Scope

Segmental Analysis

Segment by Type

• Small

Wafers up to 6 inches in diameter may be mounted manually using small systems. These kinds of setups are commonplace in R&D laboratories and boutique factories.

• Large

Wafers having a diameter of 8 inches or more may be mounted using a large manual wafer mounting device. Semiconductor foundries and other big manufacturing facilities that produce wafers in bulk often employ similar systems

Segment by Application

• Electronics

With over 60% of the market, the electronic sector represents the manual wafer mounting systems largest application category. This is a result of the rise in popularity of electronic gadgets like computers, tablets, and smartphones. Die mounting onto wafers, which are later utilized to produce electronic devices, is done manually using wafer mounting equipment.

• Semiconductor sector

With over 30% of the market share, the semiconductor industry ranks as the second-largest application segment for manual wafer mounting systems. This is because semiconductors are increasingly in demand across a range of sectors, including the automotive, telecommunications, and medical device industries. Die mounting onto wafers, which are later used to produce semiconductors, is done manually using wafer mounting equipment.

 

Regional Analysis

The Global Manual Wafer Mounting System Market is segmented by region as North America, Europe, Asia Pacific, Latin America, and Middle East and Africa.

Several significant semiconductor manufacturers and a persistent emphasis on technical innovation make North America a promising market for manual wafer mounting systems.

As the need for electronic devices and components rises in Europe, the market for manual wafer mounting systems is predicted to expand at a modest pace in the area.

With rising demand for electronics in nations like China, Japan, South Korea, and India, the Asia-Pacific region is poised to become a significant market for manual wafer mounting systems.

Increasing investment in the semiconductor sector in Latin America is likely to fuel modest expansion in the region's manual wafer mounting system market.

Due to low levels of investment in the semiconductor sector, the Middle East and Africa are predicted to have a stagnant market.

Key Players

1. UVFAB
2. Cepheus Technology
3. ADT
4. OHMIYA IND
5. Shenzhen Deshengxing Electronics
6. Technovision
7. NEONTECH
8. POWATEC
9. HIGHMAX

Recent Developments

EV Group (EVG), a major manufacturer and distributor of wafer bonding and lithography equipment, introduced their newest manual wafer bonding system, the EVG501, in February 2021. This system outperforms its predecessors and is more adaptable, making it ideal for medium- and small-sized factories.